Key Applications  
- 3D Rendering
  - Astrophysics Simulation
  - Chemistry Simulation
  - Virtualization
  - Cloud Computing
  - Research Laboratory/National Laboratory
 Key Features
1. Dual Root System for balanced
    performance & higher CPU
    to GPU communication
2. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
3. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
4. 8 PCI-E 3.0 x16 slots
    (support up to 8 double width GPU),
    2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4
5. Up to 24 Hot-swap 2.5" drive bays;
    8x 2.5" SATA drives supported
    with included H/W, 2x 2.5" NVMe
    drives supported with included H/W,
    1 NVMe based M.2 SSD
6. 2x 10GBase-T LAN ports via Intel C622
7. 8 Hot-swap 92mm RPM cooling fans
8. 2000W (2+2) Redundant Power
    Supplies Titanium Level (96%+)